Intel CEO Pat Gelsinger held a Q&A session with the press right here at Innovation 2023, and in response to a query about whether or not Intel would undertake a 3D cache strategy like AMD does with its 3D V-Cache processors, he confirmed that, whereas Intel will take a little bit of a unique strategy, it is going to additionally use stacked cache reminiscence paired with the CPU die. This expertise will not arrive with Meteor Lake, however it’s in improvement for a spread of various Intel processors sooner or later.
In response as to whether or not Intel will undertake a 3D V-Cache expertise, Gelsinger mentioned, “Whenever you reference V-Cache, you are speaking a few very particular expertise that TSMC does with a few of its prospects as nicely. Clearly, we’re doing that in another way in our composition, proper? And that specific sort of expertise is not one thing that is a part of Meteor Lake, however in our roadmap, you are seeing the concept of 3D silicon the place we’ll have cache on one die, and we’ll have CPU compute on the stacked die on high of it, and clearly utilizing EMIB that Foveros we’ll be capable of compose completely different capabilities.”
“We really feel superb that we’ve superior capabilities for next-generation reminiscence architectures, benefits for 3D stacking, for each little die, in addition to for very large packages for AI and high-performance servers as nicely. So we’ve a full breadth of these applied sciences. We’ll be utilizing these for our merchandise, in addition to presenting it to the Foundry (IFS) prospects as nicely,” Gelsinger concluded.
It is logical that Intel might undertake this type of expertise; the hybrid bonding expertise behind 3D V-Cache is not proprietary to AMD — it is enabled by TSMC’s SoIC packaging expertise. Moreover, this type of chip structure has been on the long-term horizon for chip makers for a number of years.
Stacked cache has confirmed to be a strategic benefit for AMD, because it powers the corporate’s Ryzen X3D CPUs, that are the quickest gaming processors on the earth. It is also a robust worth add for its X-series EPYC processors, like Genoa-X. Now it seems that Intel may even throw its hat into the ring with this tech, too.