Micron has reaffirmed plans to start out shipments of its HBM3E reminiscence in excessive quantity in early 2024, whereas additionally revealing that NVIDIA is one in all its main prospects for the brand new RAM. In the meantime, the corporate careworn that its new product has been obtained with nice curiosity by the trade at massive, hinting that NVIDIA will probably not be the one buyer to finish up utilizing Micron’s HBM3E.
“The introduction of our HBM3E product providing has been met with robust buyer curiosity and enthusiasm,” mentioned Sanjay Mehrotra, president and chief govt of Micron, on the firm’s earnings name.
Introducing HBM3E, which the corporate additionally calls HBM3 Gen2, forward of its rivals Samsung and SK Hynix is a giant deal for Micron, which is an underdog on the HBM market with a ten% market share. The corporate clearly pins a number of hopes on its HBM3E since it will probably allow it to supply a premium product (to drive up its income and margins) forward of its rivals (to win market share).
Usually, reminiscence makers have a tendency to not reveal names of their prospects, however this time round Micron emphasised that its HBM3E is part of its buyer’s roadmap, and particularly talked about NVIDIA as its ally. In the meantime, the one HBM3E-supporting product that NVIDIA has introduced thus far is its Grace Hopper GH200 compute platform, which options an H100 compute GPU and a Grace CPU.
“We have now been working intently with our prospects all through the event course of and have gotten a intently built-in companion of their AI roadmaps,” mentioned Mehrotra. “Micron HBM3E is presently in qualification for NVIDIA compute merchandise, which is able to drive HBM3E-powered AI options.”
Micron’s 24 GB HBM3E modules are primarily based on eight stacked 24Gbit reminiscence dies made utilizing the corporate’s 1β (1-beta) fabrication course of. These modules can hit date charges as excessive as 9.2 GT/second, enabling a peak bandwidth of 1.2 TB/s per stack, which is a 44% enhance over the quickest HBM3 modules out there. In the meantime, the corporate will not be going to cease with its 8-Hello 24 Gbit-based HBM3E assemblies. The corporate has introduced plans to launch superior capability 36 GB 12-Hello HBM3E stacks in 2024 after it initiates mass manufacturing of 8-Hello 24GB stacks.
“We anticipate to start the manufacturing ramp of HBM3E in early calendar 2024 and to attain significant revenues in fiscal 2024,” added chief govt of Micron.