SK Hynix Mulls ‘Differentiated’ HBM Reminiscence Amid AI Frenzy #Imaginations Hub

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SK Hynix and AMD had been on the forefront of the reminiscence business with the primary technology of excessive bandwidth reminiscence (HBM) again in 2013 – 2015, and SK Hynix remains to be main this market by way of share. In a bid to keep up and develop its place, SK Hynix has to adapt to the necessities of its clients, significantly within the AI area, and to take action it is mulling over how you can make ‘differentiated’ HBM merchandise for big clients.

“Growing customer-specific AI reminiscence requires a brand new strategy as the flexibleness and scalability of the expertise turns into important,” mentioned Hoyoung Son, the pinnacle of Superior Package deal Growth at SK Hynix within the standing of a vice chairman

In terms of efficiency, HBM reminiscence with a 1024-bit interface has been evolving pretty quick: it began with an information switch fee of 1 GT/s in 2014 – 2015 and reached upwards of 9.2 GT/s – 10 GT/s with the not too long ago launched HBM3E reminiscence gadgets. With HBM4, the reminiscence is ready to transit to a 2048-bit interface, which is able to guarantee regular bandwidth enchancment over HBM3E.

However there are clients which can profit from differentiated (or semi-custom) HBM-based options, based on the vice chairman.

“For implementing various AI, the traits of AI reminiscence additionally have to develop into extra various,” Hoyoung Son mentioned in an interview with BusinessKorea. “Our aim is to have quite a lot of superior packaging applied sciences able to responding to those modifications. We plan to offer differentiated options that may meet any buyer wants.”

With a 2048-bit interface, many (if not the overwhelming majority) of HBM4 options will possible be {custom} or not less than semi-custom primarily based on what we all know from official and unofficial details about the upcoming commonplace. Some clients may need to preserve utilizing interposers (however this time they’ll get very costly) and others will choose to put in HBM4 modules immediately on logic dies utilizing direct bonding methods, that are additionally costly.

Making differentiated HBM choices requires refined packaging methods, together with (however actually not restricted to) SK Hynix’s Superior Mass Reflow Molded Underfill (MR-RUF) expertise. Given the corporate’s huge expertise with HBM, it might nicely give you one thing else, particularly for differentiated choices.

“For several types of AI to be realized, the traits of AI reminiscence additionally have to be extra various,” the VP mentioned. “Our aim is to have a spread of superior packaging applied sciences to answer the shifting technological panorama. Trying forward, we plan to offer differentiated options to satisfy all buyer wants.”

Sources: BusinessKorea, SK Hynix


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